Kulicke and Soffa Industries, Inc.
KLICNASDAQ
KLIC·NASDAQ
Kulicke and Soffa Industries, Inc. (KLIC) is a leading provider specializing in the development, manufacturing, and sale of essential equipment and tools utilized in the assembly of semiconductor components. The company's operations are divided into two main divisions: Capital Equipment, and Aftermarket Products and Services (APS). Within its Capital Equipment portfolio, Kulicke and Soffa offers a broad array of sophisticated solutions, including advanced displays, as well as machinery for die-transfer, flip-chip, and TCB advanced packaging. Their product offerings further encompass ball bonders, die-attach systems, electronics assembly tools, lithography solutions, wafer-level bonders, and wedge bonders. Additionally, they supply critical consumables such as capillaries, dicing blades, and wedge bonds, alongside specialized software platforms like auto offline programming, KNet PLUS, and NPI/MES solutions. The Aftermarket Products and Services (APS) segment is dedicated to providing comprehensive support, including equipment maintenance, repairs, and performance upgrades for their installed base. Kulicke and Soffa serves a diverse global customer base, including semiconductor device manufacturers, integrated device manufacturers (IDMs), outsourced semiconductor assembly and test (OSAT) providers, various other electronics producers, industrial manufacturers, and suppliers to the automotive electronics sector. Their primary market focus is the United States and the Asia/Pacific region. Established in 1951, Kulicke and Soffa Industries, Inc. is headquartered in Singapore.
Kulicke and Soffa Industries, Inc. (KLIC) is a leading provider specializing in the development, manufacturing, and sale of essential equipment and tools utilized in the assembly of semiconductor components. The company's operations are divided into two main divisions: Capital Equipment, and Aftermarket Products and Services (APS). Within its Capital Equipment portfolio, Kulicke and Soffa offers a broad array of sophisticated solutions, including advanced displays, as well as machinery for die-transfer, flip-chip, and TCB advanced packaging. Their product offerings further encompass ball bonders, die-attach systems, electronics assembly tools, lithography solutions, wafer-level bonders, and wedge bonders. Additionally, they supply critical consumables such as capillaries, dicing blades, and wedge bonds, alongside specialized software platforms like auto offline programming, KNet PLUS, and NPI/MES solutions. The Aftermarket Products and Services (APS) segment is dedicated to providing comprehensive support, including equipment maintenance, repairs, and performance upgrades for their installed base. Kulicke and Soffa serves a diverse global customer base, including semiconductor device manufacturers, integrated device manufacturers (IDMs), outsourced semiconductor assembly and test (OSAT) providers, various other electronics producers, industrial manufacturers, and suppliers to the automotive electronics sector. Their primary market focus is the United States and the Asia/Pacific region. Established in 1951, Kulicke and Soffa Industries, Inc. is headquartered in Singapore.