ACM Research, Inc.
ACMRNASDAQ
ACMR·NASDAQ
ACM Research, Inc., along with its affiliated companies, is a global developer, manufacturer, and provider of specialized single-wafer wet cleaning systems. These crucial systems are designed to enhance manufacturing processes and improve the yield of integrated circuits across the globe. The company's innovative technological offerings include: Space Alternated Phase Shift (SAPS) technology: This system uniformly applies megasonic energy at a microscopic scale to both flat and patterned wafer surfaces by utilizing alternating phases of megasonic waves. Timely Energized Bubble Oscillation (TEBO) technology: Specifically engineered for patterned wafer surfaces at advanced process nodes, this technology precisely cleans intricate 2D and 3D patterned wafers. Tahoe technology: Providing superior cleaning performance, this solution significantly reduces the consumption of sulfuric acid and hydrogen peroxide. Electro-chemical plating technology: This offering facilitates advanced metal plating processes. ACM Research markets and sells its product line, branded as Ultra C, through a combination of its own direct sales force and independent third-party representatives. Established in 1998, ACM Research, Inc. is headquartered in Fremont, California.
ACM Research, Inc., along with its affiliated companies, is a global developer, manufacturer, and provider of specialized single-wafer wet cleaning systems. These crucial systems are designed to enhance manufacturing processes and improve the yield of integrated circuits across the globe. The company's innovative technological offerings include: Space Alternated Phase Shift (SAPS) technology: This system uniformly applies megasonic energy at a microscopic scale to both flat and patterned wafer surfaces by utilizing alternating phases of megasonic waves. Timely Energized Bubble Oscillation (TEBO) technology: Specifically engineered for patterned wafer surfaces at advanced process nodes, this technology precisely cleans intricate 2D and 3D patterned wafers. Tahoe technology: Providing superior cleaning performance, this solution significantly reduces the consumption of sulfuric acid and hydrogen peroxide. Electro-chemical plating technology: This offering facilitates advanced metal plating processes. ACM Research markets and sells its product line, branded as Ultra C, through a combination of its own direct sales force and independent third-party representatives. Established in 1998, ACM Research, Inc. is headquartered in Fremont, California.